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PCB Reverse Engineering

BGA package of PCB copy of the top ten advantages

 BGA package of PCB copy of the top tenothing, as follows:
1, BGAof PCB copy package external components rarely, in addition to the chip itself, some interconnected lines, very thin substrate, and plastic cover, the other nothing. There is no big pin, no leads to the box. The entire chip on the PCB copy of the height can be done 1.2 mm.
2, the signal from the chip, through the cable matrix, and then to your PCB, and then through the power / ground pin back to the chip to form a total loop. Small external things, small size means that the whole loop is small. The size of the BGA package loop is usually 1/2 or 1/3 of the QFP or SOIC of PCB copy, depending on the number of pins required. Small loop means small radiated noise, and crosstalk between pins becomes smaller.
3, can be very efficient design of the power and ground pin distribution. The earthing effect is also reduced by the proportion of the power supply and ground pin.
4, most of the BGA package pads are relatively large, easy to operate, than the inverted crystal packaging way to be much larger. In contrast, the crystal packaging technology requires the pad to be placed directly on the wafer, the pad needs a smaller size, which may cause some problems and manufacturing trouble. Crystal packaging technology is to some extent is invisible mystery, in fact, is not true. I hope that through the popularity of BGA to solve.
5, BGA package of PCB copy is very reliable, with the 20m pitch QFP compared to the BGA can not bend and break the pin. It is as solid as a brick.
6, BGA package can put a lot of power and ground pin on the middle, I / O port on the periphery of the lead. This is only a method that can be used to pre-route on a BGA substrate to avoid confusion in the I / O port trace.
7, advanced BGA package, you can put all the pins are placed just under the chip, not more than the chip package, which is very good miniaturization.
8, the pin at the bottom looks cool and neatly arranged.
9, do not need more advanced PCB technology. It does not like the C4 and direct crystal package way to consider the chip and PCB size to match the heat transfer efficiency to prevent damage to the wafer. BGA package cable matrix has enough mechanism to ensure the pressure on the silicon heat. There is no mismatch and difficulty.
10, a very small package itself, there is a good cooling properties. Silicon is attached to the above, most of the heat can be spread down to the BGA of PCB copy of the ball array if the silicon is attached to the bottom, then the back of the silicon and the top of the package is connected, it is very reasonable Cooling method


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