Tel:+86-755-27348087    E-mail:

PCB Reverse Engineering

How To Evaluate PCB Design And PCB Copy Engineering

 For R & D personnel, how to integrate the latest advanced technology into PCB Copy Engineering products, so that advanced technology can be embodied in superior product features, but also reflected in reducing product costs, there are many factors to consider, the product market Of the time is one of the most important factors, and around the time to market there are many decisions are constantly updated. There are many factors to consider, including product features, design implementation, product testing, and electromagnetic interference (EMI) compliance. Reducing the design iteration is possible, but it depends on the completion of the preliminary work. Most of the time, the more it is to product design and PCB Copy Engineering later the more easy to find the problem, the more painful is to find the problem to be changed. However, while many people are aware of this rule of thumb, the reality is that many companies are aware that having a highly integrated design software is important, but the idea is often compromised by high prices. This article will address the challenges of PCB design and PCB Copy Engineering, as well as a PCB designer in the assessment of a PCB design tool to consider what factors.
In this case,
The following are PCB and PCB Copy Engineering designers must consider and will affect the decision of several factors:
1. Product features
A. Basic functions that cover the basic requirements, including:
I. Schematic and PCB layout of the interaction
Ii. Automatic fan-out cabling, push-pull routing, and cabling capabilities based on design rule constraints
Iii. Accurate DRC Verifier
B. The ability to upgrade product functionality when the company is engaged in a more complex design
I.HDI (High Density Interconnect) interface
Ii. Flexible design
Iii. Embed passive components
Iv. Radio frequency (RF) design
V. Automatic script generation
Vi. Topology Placement and routing
Vii. Manufacturability (DFF), testability (DFT), manufacturability (DFM), etc.
C. Add-on products can perform simulation, digital simulation, analog-mixed-signal simulation, high-speed signal simulation and RF simulation
D. Have a central component library that is easy to create and manage
In this case,
2. A technical leader in the industry and more than other manufacturers devoted more efforts of a good partner, can help you in the shortest possible time to design the most effective and leading-edge technology products
In this case,
3. Price should be the most important factor in the above factors, need more attention is the return on investment!
PCB evaluation takes into account many factors. The type of development tools designers are looking for depends on the complexity of the design work they are engaged in. As systems are becoming more and more complex, the control of physical traces and the placement of electrical components has grown to such a wide extent that constraints on the critical path in the design process must be set. However, too much design constraints are tied to the design flexibility. Designers must understand their design and its rules well so that they know exactly when to use them.
During the assessment, the designer must ask himself: What criteria are critical to them?
Let's look at some of the trends that are forcing designers to re-examine their existing development tools functionality and begin ordering new features:
1. HDI
Semiconductor complexity and the increase in the total amount of logic gates have been asked to have more integrated circuit pins and more fine pitch. It is common practice to design more than 2000 pins on a 1mm pitch BGA device, not to mention the placement of 296 pins on devices with 0.65mm pitch. Increasingly faster rise time and signal integrity (SI) requirements necessitate a greater number of power and ground pins, and therefore require more layers in the multilayer board, thereby driving the micro via Density interconnect (HDI) technology.
HDI is an interconnection technology that is being developed in response to these needs. Microvia and ultrathin dielectrics, finer traces, and smaller line spacing are key features of HDI technology.
2.RF design
For RF design, RF circuits should be designed directly into system schematics and system board layouts, rather than in a separate environment for subsequent conversions. All of the simulation, tuning, and optimization capabilities of the RF simulation environment are still required, but the simulation environment accepts more raw data than the "real" design. As a result, the differences between data models and the resulting design transformations will disappear. First, the designer can interact directly with the system design and the RF simulation; second, if the designer performs a large-scale or rather complex RF design, they may want to distribute the circuit simulation task to multiple computing platforms running in parallel, or They wanted to send each circuit of a design consisting of multiple modules to their respective simulators, shortening the simulation time.
3. Advanced packaging
Increasing functional complexity of modern products requires a corresponding increase in the number of passive components, mainly in low-power, high-frequency applications, the number of decoupling capacitors and terminal matching resistance increases. Although the packaging of passive surface-mount devices has shrunk considerably over the years, the results are still the same when trying to achieve maximum limiting density. Printed components technology from multi-chip components (MCM) and mixed components to today can be directly used as embedded passive components of the SiP and PCB. In the transformation process using the latest assembly technology. For example, the inclusion of a layer of resistive material in a layered structure and the use of series terminating resistors directly beneath the micro-ball grid array (uBGA) package have greatly improved circuit performance. Now, embedded passive components can be designed with high accuracy, eliminating the need for additional processing steps to clean the laser weld. Wireless components are also moving directly in the substrate to improve the integration of the direction of development.
In this case,
4. Rigid flexible PCB
In order to design a rigid flexible PCB, all factors that affect the assembly process must be considered. Designers can not simply design a rigid flex PCB just like a rigid PCB, just as the rigid flex PCB is just another rigid PCB. They must manage the design of the bending area to ensure that the design points will not lead to the bending surface of the stress caused by the role of conductor fracture and stripping. There are still many mechanical factors to consider, such as minimum bend radius, dielectric thickness and type, sheet weight, copper plating, overall circuit thickness, number of layers, and number of bent portions.
Understand the rigid and flexible design and determine whether your product allows you to create a rigid and flexible design.
In this case,
5. Signal integrity planning
In recent years, new techniques for serial-to-parallel conversion and serial interconnects have been developed with respect to parallel bus architectures and differential pair architectures.
Figure 2 illustrates the type of typical design problem encountered for a parallel bus and serial-to-parallel conversion design. Parallel bus design is limited to changes in system timing, such as clock skew and propagation delay. Due to the clock skew on the entire bus width, the design for timing constraints is still difficult. Increasing the clock rate will only make the problem worse.
Figure 2: Typical design issues encountered in parallel bus and serial-to-parallel conversion designs.
On the other hand, the differential pair architecture uses an exchangeable point-to-point connection at the hardware level for serial communication. Typically, it transfers data through a unidirectional serial "channel", which is a configuration that can be superimposed into 1-, 2-, 4-, 8-, 16-, and 32-widths. Each channel carries one byte of data, so the bus can handle data widths from 8 bytes to 256 bytes, and can maintain data integrity by using some form of error detection technique. However, due to the high data rate, other design problems are caused. Clock recovery at high frequencies is a burden on the system because the clocks need to quickly lock the input data stream and reduce jitter for all cycles to cycles in order to improve the anti-shake performance of the circuit. Power-supply noise also creates additional problems for designers. This type of noise increases the likelihood of severe jitter, which can make opening the eye more difficult. An additional challenge is to reduce common-mode noise and address the problems associated with the loss effects from the IC package, PCB board, cables, and connectors.
In this case,
6. Design the practicality of the package
USB, DDR / DDR2, PCI-X, PCI-Express and RocketIO design kits will undoubtedly help designers move into the new technology arena. The design suite gives an overview of the technology, a detailed description, and the difficulties designers will face, followed by simulation and how to create routing constraints. Together with the program, it provides an explanatory document, which provides designers with a mastery of advanced new technologies.


Email me