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6 Layer PCB Manufacturer With Stack up Types

Introduction to PCB Stackup

Printed Circuit Board (PCB) stackup refers to the arrangement of copper layers and insulating materials that make up a PCB. The stackup determines the electrical properties, signal integrity, and manufacturability of the board. In this article, we will focus on 6 layer PCB stackups and their various types.

What is a 6 Layer PCB?

A 6 layer PCB is a printed circuit board that consists of six conductive copper layers separated by insulating dielectric materials. These layers are strategically arranged to provide optimal signal routing, power distribution, and ground planes. 6 layer PCBs offer increased complexity and functionality compared to boards with fewer layers.

Advantages of 6 Layer PCBs

  1. Enhanced signal integrity
  2. Improved power distribution
  3. Better EMI/EMC performance
  4. Increased routing density
  5. Reduced board size

Types of 6 Layer PCB Stackups

There are several types of 6 layer PCB stackups, each with its own advantages and applications. Let’s explore some of the most common stackup configurations.

1. Standard 6 Layer Stackup

The standard 6 layer stackup is the most basic configuration, consisting of the following layers:

  1. Top Layer (Signal)
  2. Ground Plane
  3. Signal Layer
  4. Signal Layer
  5. Power Plane
  6. Bottom Layer (Signal)

This stackup provides a balance between signal integrity and power distribution. The ground and power planes help to reduce noise and provide a stable reference for the signal layers.

2. Hybrid 6 Layer Stackup

A hybrid 6 layer stackup combines the benefits of both standard and HDI (High Density Interconnect) PCBs. It typically includes the following layers:

  1. Top Layer (Signal)
  2. Ground Plane
  3. Signal Layer
  4. Signal Layer
  5. Ground Plane
  6. Bottom Layer (Signal with microvias)

The bottom layer incorporates microvias, which are small, laser-drilled holes that connect the bottom layer to the layer above it. This allows for higher routing density and improved signal integrity in critical areas of the board.

3. Impedance Controlled 6 Layer Stackup

Impedance controlled stackups are designed to maintain consistent impedance throughout the signal paths. This is crucial for high-speed digital circuits and RF applications. A typical impedance controlled 6 layer stackup may include:

  1. Top Layer (Signal with controlled impedance)
  2. Ground Plane
  3. Signal Layer (with controlled impedance)
  4. Signal Layer (with controlled impedance)
  5. Power Plane
  6. Bottom Layer (Signal with controlled impedance)

The dielectric thickness and material properties are carefully chosen to achieve the desired impedance values, such as 50Ω for single-ended traces or 100Ω for differential pairs.

4. HDI 6 Layer Stackup

HDI (High Density Interconnect) stackups incorporate microvias and buried vias to achieve higher routing density and smaller form factors. An example of an HDI 6 layer stackup:

  1. Top Layer (Signal with microvias)
  2. Ground Plane
  3. Signal Layer (with buried vias)
  4. Signal Layer (with buried vias)
  5. Power Plane
  6. Bottom Layer (Signal with microvias)

HDI stackups are suitable for complex designs with high component density and limited board space.

Designing a 6 Layer PCB Stackup

When designing a 6 layer PCB stackup, several factors must be considered to ensure optimal performance and manufacturability.

1. Material Selection

The choice of dielectric materials and their properties (e.g., dielectric constant, loss tangent) significantly impact the electrical characteristics of the board. Common materials include FR-4, Rogers, and Isola.

2. Layer Arrangement

The arrangement of signal, ground, and power layers should be carefully planned to minimize crosstalk, reduce EMI, and ensure proper power distribution. Generally, signal layers should be adjacent to ground or power planes to provide a reference and reduce noise.

3. Via Types and Placement

The use of through-hole, blind, buried, and microvias depends on the stackup configuration and design requirements. Via placement should be optimized to minimize signal reflections and improve routing efficiency.

4. Impedance Control

For high-speed designs, impedance control is crucial. The stackup should be designed to maintain consistent impedance across signal traces, considering factors such as trace width, dielectric thickness, and copper weight.

5. Manufacturability

The stackup design must also consider manufacturing capabilities and constraints. Factors such as minimum trace width, spacing, and hole size should be discussed with the PCB manufacturer to ensure feasibility and cost-effectiveness.

PCB Stackup Design Tools

Several software tools are available to assist in designing and analyzing PCB stackups. Some popular options include:

  1. Altium Designer
  2. Cadence Allegro
  3. Mentor Graphics PADS
  4. Zuken CR-8000
  5. Sierra Circuits Stackup Planner

These tools help designers create, optimize, and validate stackups, ensuring compliance with design rules and manufacturing guidelines.

Choosing a 6 Layer PCB Manufacturer

When selecting a 6 layer PCB manufacturer, consider the following factors:

  1. Manufacturing capabilities and experience
  2. Quality control processes
  3. Lead times and pricing
  4. Customer support and communication
  5. Certifications (e.g., ISO, UL, RoHS)

A reputable manufacturer should be able to provide guidance on stackup design, material selection, and DFM (Design for Manufacturability) to ensure the best possible outcome for your project.


1. What is the typical thickness of a 6 layer PCB?

The thickness of a 6 layer PCB can vary depending on the dielectric materials and copper weights used. A common thickness range is between 1.0mm and 2.0mm, with 1.6mm being a popular choice.

2. Can a 6 layer PCB have more than one power plane?

Yes, a 6 layer PCB can have multiple power planes to distribute different voltage levels across the board. The number and arrangement of power planes depend on the specific design requirements.

3. What are the benefits of using blind and buried vias in a 6 layer PCB?

Blind and buried vias help to increase routing density and minimize board size by allowing more efficient use of the inner layers. They also improve signal integrity by reducing the length of the signal paths.

4. How does the choice of dielectric material affect the performance of a 6 layer PCB?

The dielectric material’s properties, such as dielectric constant and loss tangent, influence the signal propagation speed, impedance, and loss. Choosing the right material is essential for maintaining signal integrity and meeting the design’s electrical requirements.

5. What are the challenges in manufacturing a 6 layer PCB compared to boards with fewer layers?

Manufacturing a 6 layer PCB is more complex and time-consuming than producing boards with fewer layers. Challenges include maintaining proper layer registration, ensuring reliable via connections, and managing the increased thermal stress during the assembly process. Working with an experienced manufacturer is crucial to overcoming these challenges and achieving a high-quality product.


6 layer PCBs offer a powerful solution for complex electronic designs that require high functionality, signal integrity, and power distribution. By understanding the different stackup types and their advantages, designers can create optimized 6 layer PCBs that meet their specific requirements. Careful consideration of material selection, layer arrangement, via placement, impedance control, and manufacturability is essential for a successful design. Choosing a reputable 6 layer PCB manufacturer with the necessary expertise and capabilities ensures that your design will be brought to life with the highest quality and reliability.