Introduction to NORDIC HDI and Happy Holden

NORDIC HDI (High Density Interconnect) is a leading company in the PCB (printed circuit board) industry, known for its cutting-edge technology and innovative solutions. The company recently held a seminar featuring Happy Holden, a renowned expert in the field of PCB Design and manufacturing.

Happy Holden is a senior technologist at Gentex Corporation and has over 50 years of experience in the PCB industry. He is a frequent speaker at industry events and has authored numerous articles and books on PCB design and manufacturing.

Overview of the NORDIC HDI seminar

The NORDIC HDI seminar was held on March 15th, 2023 at the NORDIC HDI headquarters in Stockholm, Sweden. The seminar was attended by over 100 industry professionals, including PCB designers, engineers, and executives.

The seminar covered a wide range of topics related to HDI PCBs, including:

• Advanced HDI design techniques
• New materials and processes for HDI PCBs
• HDI reliability and testing
• Future trends in HDI technology

Key takeaways from Happy Holden’s presentation

Happy Holden’s presentation was one of the highlights of the seminar. He shared his insights on the current state of the HDI PCB industry and the challenges and opportunities facing designers and manufacturers.

Some of the key takeaways from his presentation include:

The importance of early collaboration between designers and manufacturers

Holden emphasized the importance of early collaboration between PCB designers and manufacturers to ensure the success of HDI projects. He noted that designers need to have a good understanding of the manufacturing process and the limitations of different materials and technologies.

Holden also stressed the importance of using design for manufacturing (DFM) techniques to optimize designs for manufacturability and reliability. He shared several examples of DFM techniques that can be used in HDI designs, such as:

• Using via-in-pad technology to reduce layer count and improve signal integrity
• Optimizing trace widths and spacing to minimize crosstalk and signal loss
• Using copper thieving to balance copper distribution and prevent warpage

The need for advanced materials and processes

Holden discussed the need for advanced materials and processes to meet the demanding requirements of HDI PCBs. He noted that traditional FR-4 materials may not be suitable for high-speed, high-frequency applications due to their limited dielectric properties and thermal stability.

Holden highlighted several advanced materials that are being used in HDI PCBs, such as:

• Low-loss, high-speed laminates (e.g. Rogers, Isola)
• Embedded capacitance materials for power integrity
• Thermally conductive materials for heat dissipation

He also discussed some of the new processes that are being used in HDI manufacturing, such as:

• Modified semi-additive process (mSAP) for fine line and space
• Advanced via formation techniques (e.g. laser, plasma)
• 3D printing for rapid prototyping and low-volume production

The challenges of HDI reliability and testing

Holden noted that HDI PCBs pose unique challenges for reliability and testing due to their high density and complexity. He emphasized the importance of designing for reliability and using appropriate testing methods to ensure the quality and performance of HDI PCBs.

Some of the key reliability challenges in HDI PCBs include:

• Via reliability (e.g. micro-via, stacked via)
• Copper crack and delamination
• Thermal cycling and stress

To address these challenges, Holden recommended using a combination of design techniques, material selection, and testing methods. He shared some examples of reliability testing methods that are commonly used for HDI PCBs, such as:

• Interconnect stress test (IST)
• Thermal shock and cycling
• Highly accelerated life test (HALT)
• 3D x-ray and acoustic microscopy

Future trends in HDI technology

Holden concluded his presentation by discussing some of the future trends in HDI technology. He noted that the demand for HDI PCBs is expected to continue to grow, driven by the increasing complexity and miniaturization of electronic devices.

Some of the key trends that Holden highlighted include:

• Increasing use of advanced packaging technologies (e.g. 2.5D, 3D)
• Adoption of 5G and millimeter-wave applications
• Integration of active and passive components
• Use of artificial intelligence and machine learning in design and manufacturing

Holden also emphasized the importance of sustainability and environmental responsibility in the PCB industry. He noted that there is a growing trend towards using eco-friendly materials and processes, such as halogen-free laminates and Lead-Free Solders.

Conclusions and recommendations

The NORDIC HDI seminar with Happy Holden provided valuable insights into the current state and future trends of the HDI PCB industry. The key takeaways from the seminar include:

• The importance of early collaboration between designers and manufacturers
• The need for advanced materials and processes to meet the demanding requirements of HDI PCBs
• The challenges of HDI reliability and testing
• The future trends in HDI technology, including advanced packaging, 5G, and sustainability

Based on these insights, we recommend the following actions for PCB designers and manufacturers:

1. Foster close collaboration and communication between design and manufacturing teams to optimize designs for manufacturability and reliability.

2. Invest in advanced materials and processes to stay competitive in the HDI market.

3. Prioritize reliability and testing throughout the design and manufacturing process.

4. Stay up-to-date with the latest trends and technologies in HDI, such as advanced packaging and 5G.

5. Consider sustainability and environmental responsibility in material selection and process development.

By following these recommendations, PCB designers and manufacturers can position themselves for success in the rapidly evolving HDI market.

FAQ

What is HDI PCB?

HDI (High Density Interconnect) PCB is a type of printed circuit board that features high wiring density per unit area. HDI PCBs typically have smaller vias, finer lines and spaces, and higher layer counts compared to traditional PCBs.

What are the benefits of HDI PCBs?

The main benefits of HDI PCBs include:

• Reduced size and weight
• Improved signal integrity and speed
• Higher reliability and durability
• Lower power consumption
• Increased functionality and flexibility

What are some of the challenges in designing and manufacturing HDI PCBs?

Some of the key challenges in HDI PCBs include:

• Ensuring the reliability of micro-vias and stacked vias
• Managing signal integrity and power integrity in high-speed designs
• Selecting appropriate materials for high-frequency and high-temperature applications
• Optimizing designs for manufacturability and testability
• Balancing cost and performance in material and process selection

What are some of the advanced materials used in HDI PCBs?

Some of the advanced materials used in HDI PCBs include:

• Low-loss, high-speed laminates (e.g. Rogers, Isola)
• Embedded capacitance materials for power integrity
• Thermally conductive materials for heat dissipation
• Halogen-free and lead-free materials for sustainability

What are some of the future trends in HDI technology?

Some of the future trends in HDI technology include:

• Increasing use of advanced packaging technologies (e.g. 2.5D, 3D)
• Adoption of 5G and millimeter-wave applications
• Integration of active and passive components
• Use of artificial intelligence and machine learning in design and manufacturing
• Growing emphasis on sustainability and eco-friendly materials and processes