What Is a PCB Clone Service?
A PCB clone service takes a physical circuit board—often one with no surviving design files—and reverse-engineers it into a complete, production-ready data package. The goal is a 1:1 functional duplicate: same copper geometry, same component placement, same electrical behavior. Our engineers extract Gerber files, a bill of materials, and a netlist-verified schematic from your sample board, then validate the clone against the original using automated optical inspection and electrical test before a single production panel is cut.
Why Engineers Need Board Cloning
The reasons a PCB clone becomes necessary are almost always practical, not theoretical. Here are the scenarios we handle most often:
- Obsolete-equipment maintenance. The OEM no longer exists or refuses to supply replacement boards. A single failed controller can idle a production line costing $10,000+ per hour in downtime.
- Lost design data. A hard-drive crash, a departed engineer, or an acquisition that never transferred the CAD files. The board in your hand is the only source of truth.
- Second-source qualification. You own the IP but need a backup fabricator. Cloning the board from a known-good sample ensures the second source matches the first.
- Small-batch production restart. Original tooling is gone, MOQs have changed, or the fab shop shut down. Cloning lets you restart production from 5 to 5,000 pieces without re-designing from scratch.
How Our PCB Clone Process Works
Step 1 — Sample Intake and Feasibility Review
You ship one or two known-good boards. Our team photographs both sides at 2400 DPI, inspects under a stereo microscope, and runs a preliminary layer-count check using cross-section or X-ray imaging. Within 2 business days we return a feasibility report: layer count, estimated complexity grade, and a firm quote. There is no charge for this review.
Step 2 — Delayering and Imaging
For multilayer boards (4–28 layers), we micro-section the PCB to expose each copper layer individually. Each layer is scanned at up to 4800 DPI optical resolution, then vectorized into CAD data. Single- and double-sided boards skip delayering entirely—surface imaging and X-ray are sufficient.
Step 3 — Gerber Reconstruction
Scanned images are converted into Gerber RS-274X files layer by layer. Pad geometries, trace widths (down to 3 mil / 0.076 mm), via drill sizes, and board outline are captured with a positional accuracy of ±0.5 mil (±0.0127 mm). Our CAD operators cross-reference every feature against the physical board at least twice.
Step 4 — BOM Extraction
Every component is catalogued: manufacturer part number, package footprint, value, and reference designator. Where markings are worn or parts are house-marked, we use LCR meters, curve tracers, and datasheet cross-referencing to identify equivalents. The final BOM includes at least one alternate source per line item when available.
Step 5 — Schematic Recovery
A full schematic is drawn from the netlist, organized into functional blocks—power supply, signal processing, I/O, protection. This schematic is netlist-compared against the Gerber data to ensure zero mismatches.
Step 6 — Verification and Delivery
Before delivery, we fabricate a small pilot run (typically 2–5 pieces) and perform:
- Automated optical inspection (AOI) comparing clone vs. original at component and solder-joint level.
- Flying-probe electrical test on 100% of nets.
- Functional power-on test if you supply a test fixture or procedure.
You receive Gerber files, drill files, a component-placement file (pick-and-place CSV), the BOM in Excel format, the schematic in PDF and editable format (Altium / KiCad / OrCAD), and a verification report.
What You Get: Deliverable Package
| Deliverable | Format | Notes |
|---|---|---|
| Gerber files (all layers) | RS-274X | Copper, mask, silk, paste, outline |
| NC drill file | Excellon | Plated and non-plated holes separated |
| Pick-and-place data | CSV / Excel | X-Y coordinates, rotation, side |
| Bill of Materials | Excel | MPN, value, package, alternates |
| Schematic | PDF + native CAD | Altium, KiCad, or OrCAD on request |
| Stackup specification | Layer order, dielectric thickness, copper weight | |
| Impedance report | For controlled-impedance boards only | |
| Verification report | AOI images, test results, deviation log |
Accuracy and Tolerance Specifications
Accuracy is the difference between a clone that works and one that becomes expensive scrap. Here is what we hold across different board classes:
| Parameter | Standard Boards (IPC Class 2) | High-Density / HDI (IPC Class 3) |
|---|---|---|
| Trace width accuracy | ±0.5 mil (±0.013 mm) | ±0.3 mil (±0.008 mm) |
| Pad position accuracy | ±0.5 mil | ±0.3 mil |
| Drill size tolerance | ±1 mil | ±0.5 mil |
| Minimum trace/space captured | 4 / 4 mil | 3 / 3 mil |
| Layer-to-layer registration | ±2 mil | ±1 mil |
| Board outline tolerance | ±5 mil | ±3 mil |
For controlled-impedance designs—common in RF PCB cloning and telecom boards—we extract the original stackup and run impedance simulations (typically in Polar Si9000) to match target impedance within ±5 Ω on single-ended traces and ±8 Ω on differential pairs.
Board Types We Clone
Our PCB clone service covers the full spectrum of board technologies. Complexity drives timeline and cost, not feasibility—we have successfully cloned boards from 1 layer to 28 layers.
- Rigid FR-4 boards — 1 to 28 layers, standard or high-Tg laminates. High-Tg PCB duplication requires laminate-specific stackup matching.
- Flexible and FPC boards — Polyimide substrates with tight bend-radius constraints. See our notes on flexible PCB cloning challenges.
- Aluminum-core and metal-core boards — Common in LED drivers and power converters. Aluminum PCB cloning demands accurate thermal-pad extraction.
- PTFE and microwave substrates — Rogers, Taconic, Isola; dielectric constant matching is critical. Details on our PTFE board duplication process.
- Ceramic substrates — LTCC and thick-film boards used in harsh environments.
- Backplane and high-pin-count boards — Large-format boards with press-fit connectors and dense via fields.
Industry-Specific Cloning Experience
Board cloning requirements vary sharply by sector. A medical-device board demands IPC Class 3 and full traceability; an industrial motor drive needs heavy copper and creepage compliance. We tailor the clone process to the standard your industry requires.
- Automotive electronics — AEC-Q-grade components, conformal-coating notes preserved. Learn more about automotive PCB duplication under NDA.
- Aerospace and defense — ITAR-aware handling, MIL-PRF-31032 references, serialized documentation.
- Telecom and networking — High-speed differential pairs, controlled impedance, dense BGA layouts.
- Robotics and drones — Mixed rigid-flex, compact form factors, sensor-interface boards. Our drone PCB copy workflow covers the typical challenges.
- Industrial instrumentation — Precision analog sections, isolated power domains, EMI shielding layers.
What Can Go Wrong—and How We Handle It
Honest engineering means acknowledging failure modes. Here are the most common issues in PCB cloning and our mitigations:
Buried or Blind Via Misidentification
On boards with microvias or stacked vias, imaging alone can miss buried connections. We use X-ray laminography at 5 µm resolution to map every via type before delayering.
Component Identification on House-Marked Parts
Some OEMs sand off or remark ICs. When a part number is unreadable, we decap the package and identify the die, or use curve-trace signatures against known parts. This adds 2–5 business days but avoids BOM errors.
Impedance Mismatch After Fabrication
Even with correct Gerber data, a different fab shop may use slightly different prepreg or core thicknesses. We specify the exact laminate and stackup in the deliverable package, and recommend a TDR coupon on the first production panel to confirm impedance before full-volume runs.
Programmed Firmware on MCUs
Cloning the PCB does not clone the firmware. If the board contains a microcontroller with protected flash, firmware readout is a separate, authorization-required process. We only perform IC readout when the client provides proof of IP ownership or written authorization, under NDA.
Turnaround and Pricing Signals
We quote every project individually because complexity varies enormously, but here are realistic ranges:
| Board Class | Typical Turnaround | Starting Price (USD) |
|---|---|---|
| 1–2 layer, ≤100 components | 5–7 working days | $300 |
| 4–6 layer, ≤300 components | 8–12 working days | $800 |
| 8–12 layer, ≤600 components | 12–18 working days | $1,800 |
| 14–28 layer / HDI | 18–30 working days | $3,500+ |
| Rigid-flex or exotic substrate | 15–25 working days | $2,500+ |
Pilot-run fabrication and assembly are quoted separately. Rush service (40% surcharge) can compress timelines by roughly 30%.
Check feasibility for your project
Send the chip marking or board details and tell us what you need to recover. Add clear photos if available.
Request a feasibility reviewFrequently Asked Questions
How many sample boards do I need to send for cloning?
One known-good board is the minimum. We recommend sending two if available—one for non-destructive imaging and one for destructive delayering on multilayer designs. For single- or double-sided boards, one sample is usually sufficient because no delayering is required.
Will the cloned board work identically to the original?
When the copper geometry, component values, and stackup are accurately reproduced, the clone is electrically equivalent. We verify this with flying-probe test and, when possible, functional power-on testing. The one caveat is firmware—if the original board runs programmed microcontrollers, those require separate authorized readout and programming.
Is PCB cloning legal?
Cloning a board you own—or have authorization to reproduce—for maintenance, second-sourcing, or legacy support is lawful in most jurisdictions. We require clients to confirm ownership or authorization before starting work, and every project is covered by a mutual NDA. We do not accept projects that involve copying a competitor’s proprietary design without rights.
Can you clone a board with BGA or QFN packages?
Yes. BGA and QFN footprints are captured using X-ray imaging to map ball/pad arrays underneath the package. We extract exact pad pitch, diameter, and solder-mask opening dimensions. BGA rework stations allow us to remove and reattach components when needed for layer access.
What if some components are obsolete?
Our BOM includes cross-referenced alternates for every line item. If a part is end-of-life with no direct replacement, we flag it and propose a pin-compatible or functionally equivalent substitute, noting any design-change implications in the verification report.
Related Board Cloning Resources
- Power PCB cloning — heavy copper and thermal management
- Lighting PCB duplication for LED driver boards
Check feasibility for your project
Send the chip marking or board details and tell us what you need to recover. Add clear photos if available.
Request a feasibility reviewWorking on a board like this?
Send the chip marking or two photos. You get feasibility, lead time and price within 24 hours, and the check costs nothing.
Get a free quote