PCBA processing poor wetting solution

PCBA processing wetting bad solution

PCBA processing wetting bad also called not wetting or half wetting, refers to the solder and substrate soldering area in the soldering process, after wetting does not generate mutual reaction layer, and cause leakage or less soldering failure. In the PCBA processing, when the solder surface tension is destroyed, it will cause the surface mount component’s poor welding.

The main causes of poor wetting are:

1, the surface of the soldering area is contaminated, the surface of the soldering area stained with flux, or the surface of the SMD components generated metal compounds. All will cause poor wetting. Such as silver surface sulfide, the surface of tin oxide, etc. will produce poor wetting.

2, when the residual metal in the solder more than 0.005%, the degree of flux activity is reduced, the phenomenon of poor wetting will also occur.

3, wave soldering, the existence of gas on the surface of the substrate, it is also easy to produce poor wetting.

The methods to solve the poor wetting are:

1, strict implementation of the corresponding soldering process.

2, PCB board and component surface should be well cleaned.

3, choose the appropriate solder, and set a reasonable soldering temperature and time.

Car reversing radar

Shenzhen RayMing technology according to the information provided by customers, has successfully achieved a full set of research and development and has been delivered to customers complete finished products and other typical product cases, only for customers and engineers reference to learn!

The reversing radar is composed of ultrasonic sensing (probe), controller and display (or buzzer) and other parts. Backing radar adopts ultrasonic distance principle, under the control of the controller, the sensor emits ultrasonic signal, when encountering obstacles, generate echo signal, the sensor receives the echo signal by the controller for data processing and judgment of the location of obstacles, the display shows the distance and other warning signals, get timely warning, the motorist can do when backing up ” Number”, so that reversing becomes easier and safer.
In the past, reversing radar products are only suitable for installation in cars, and become the standard configuration of high-end cars. Now the new reversing radar has a great improvement in the probe, whether it is a station wagon, MPV, jeep or off-road vehicles with bumpers, etc. There is a corresponding sensor to match, so that the reversing radar is gradually popularized in other car types.
In addition, the new reversing radar not only provides sound alert, but also can look at the scene behind the car through the optional display, reflecting the distance and judging the direction, and the sound alarm has an adjustable switch, which can be turned up, down or off according to personal preference.
RayMing technology long-term electronic market to provide electronic products circuit board development, software programming to finished products processing of a full set of services. Welcome domestic and foreign customers to contact us!

Analysis of the causes of tin beads produced by PCBA wave soldering

During PCBA wave soldering, solder spatter may occur on the solder surface of the PCB and on the component surface. It is commonly believed that if water vapor remains on the PCB before it enters the wave, once it comes into contact with the solder on the wave, it will quickly evaporate into steam within a very short period of time at high temperatures. Up, resulting in an explosive exhaust process. It is this intense exhaust that can cause a small explosion inside the solder seam in the molten state, resulting in particles of solder escaping from the seam and thus splashing onto the PCB. Conclusion:

manufacturing environment and PCB storage time
The manufacturing environment has a significant impact on the solder quality of electronic components. High humidity in the manufacturing environment, long periods of PCB packaging and opening for SMT placement process and PCBA wave soldering production, or PCBA wave soldering after a period of PCB placement, insertion, all these factors may produce tin beads in the PCBA wave soldering process.

If the manufacturing environment is too humid, in the product manufacturing process will be easy to accumulate water on the surface of the PCB floating in the air condensation, condensation of water, in the PCB hole, when the PCBA wave soldering, preheating temperature area in the hole will have fine droplets of water may not be fully completed, these will not evaporate, water droplets will be in contact with the PCBA wave soldering, bear high temperature, steam will evaporate in a short time, but now is the time to form a solder joint, the water vapor will create voids in the solder, tin or extruded solder balls. In severe cases, an explosive spot is formed, surrounded by tiny beads of blown tin.

If the PCB in the package is opened for a long time after the PCBA wave soldering, there will also be condensation beads in the through-hole; after the completion of the placement or cartridge, the PCB will also condense after sitting for a period of time. For the same reason, these beads will lead to the formation of solder beads during PCBA wave soldering.

Therefore, as a company engaged in SMT patch processing, the requirements of the manufacturing environment and the timing of the product manufacturing process are particularly important. The PCB should be inserted and soldered within 24 hours after the patch is completed. If the weather is dry, it can be done within 48 hours.

PCB resistance welding materials and production quality

Solder film used in PCB manufacturing is also one of the reasons for tin balls in PCBA wave soldering. As the solder film and flux have a certain degree of affinity, the processing of the solder film often leads to the attachment of solder beads, which leads to the generation of solder balls.

PCB manufacturing quality is poor will also produce tin balls in the PCBA wave soldering process. If the PCB through-hole hole wall coating is thin or there are gaps in the coating, the water attached to the PCB through-hole will be heated to steam, the water vapor will be discharged through the hole wall, and the solder will produce solder balls. Therefore, the appropriate coating thickness in the through-hole is very critical.

When there is dust or dirt in the PCB via hole, the flux sprayed into the via hole will not get enough volatiles in the PCBA wave soldering process, and the liquid flux (such as water vapor) will also produce tin beads when it encounters the wave.

Correct selection of flux

There are many reasons for solder balls, but flux is the main reason. General low solid content, no-clean flux is more likely to form solder balls, especially when the bottom surface of the SMD components need to double PCBA wave soldering, this is because these additives are not designed to be used for a long time. If the flux sprayed on the PCB after the first wave has been used up, there is no flux after the second wave, so it can not function as a flux and help reduce solder balls. One of the main ways to reduce the number of solder balls is to choose the right flux. Choose a flux that can withstand heat for a longer period of time.

Shenzhen RayMing is an electronic product processing company specializing in SMT chip processing, DIP plug-in processing, PCBA package, PCB circuit board manufacturing, with 16 years of experience in electronic processing, as well as advanced production equipment and perfect after-sales service system. Welcome new and old customers to call us!

FPC chip processing

FPC SMD processing process: pretreatment → fixed → printing → SMD → reflow → test → inspection → sub-board.

FPC SMD processing need to provide information: 1. complete FPC do board file (Gerber file, placement chart, stencil file) and do board requirements; 2. complete BOM (including model, brand, package, description, etc.); 3. PCBA assembly diagram. ps: report PCBA function test cost, need to provide PCBA function test method.

FPC SMD processing notes:
FPC fixed: from printing SMD to reflow soldering throughout the fixed on the pallet, the pallet used requires a small coefficient of thermal expansion.

solder paste printing: because the pallet is loaded with FPC, FPC with high-temperature tape for positioning, so that the height is not consistent with the pallet plane, so the printing must choose the elastic scraper, solder paste composition has a greater impact on the printing effect, you must choose the right solder paste.

mounting equipment: first, the best solder paste printing machine with optical positioning system, otherwise the quality of welding will have a greater impact. Secondly, the FPC is fixed on the pallet, but there will always be some tiny gap between the FPC and the pallet, which is a big difference with the PCB substrate. Therefore the equipment parameter setting will have a big influence on the printing effect, the placement accuracy and the welding effect.

Shenzhen RayMing technology is a professional FPC flexible circuit board SMT processing company, with more than ten years of experience in FPC flexible board SMD processing of a team of senior engineers, the industry’s first-class professional standard SMT factory management, professional to undertake FPC SMD processing business.

Analysis of the causes of tin beads produced by PCBA wave soldering

During PCBA wave soldering, solder spatter may occur on the solder surface of the PCB and on the component surface. It is commonly believed that if water vapor remains on the PCB before it enters the wave, once it comes into contact with the solder on the wave, it will quickly evaporate into steam within a very short period of time at high temperatures. Up, resulting in an explosive exhaust process. It is this intense exhaust that can cause a small explosion inside the solder seam in the molten state, resulting in particles of solder escaping from the seam and thus splashing onto the PCB. Conclusion:

manufacturing environment and PCB storage time
The manufacturing environment has a significant impact on the solder quality of electronic components. High humidity in the manufacturing environment, long periods of PCB packaging and opening for SMT placement process and PCBA wave soldering production, or PCBA wave soldering after a period of PCB placement, insertion, all these factors may produce tin beads in the PCBA wave soldering process.

If the manufacturing environment is too humid, in the product manufacturing process will be easy to accumulate water on the surface of the PCB floating in the air condensation, condensation of water, in the PCB hole, when the PCBA wave soldering, preheating temperature area in the hole will have fine droplets of water may not be fully completed, these will not evaporate, water droplets will be in contact with the PCBA wave soldering, bear high temperature, steam will evaporate in a short time, but now is the time to form a solder joint, the water vapor will create voids in the solder, tin or extruded solder balls. In severe cases, an explosive spot is formed, surrounded by tiny beads of blown tin.If the PCB in the package is opened for a long time after the PCBA wave soldering, there will also be condensation beads in the through-hole; after the completion of the placement or cartridge, the PCB will also condense after sitting for a period of time. For the same reason, these beads will lead to the formation of solder beads during PCBA wave soldering.

Therefore, as a company engaged in SMT patch processing, the requirements of the manufacturing environment and the timing of the product manufacturing process are particularly important. The PCB should be inserted and soldered within 24 hours after the patch is completed. If the weather is dry, it can be done within 48 hours.

PCB resistance welding materials and production quality

Solder film used in PCB manufacturing is also one of the reasons for tin balls in PCBA wave soldering. As the solder film and flux have a certain degree of affinity, the processing of the solder film often leads to the attachment of solder beads, which leads to the generation of solder balls.

PCB manufacturing quality is poor will also produce tin balls in the PCBA wave soldering process. If the PCB through-hole hole wall coating is thin or there are gaps in the coating, the water attached to the PCB through-hole will be heated to steam, the water vapor will be discharged through the hole wall, and the solder will produce solder balls. Therefore, the appropriate coating thickness in the through-hole is very critical.

When there is dust or dirt in the PCB via hole, the flux sprayed into the via hole will not get enough volatiles in the PCBA wave soldering process, and the liquid flux (such as water vapor) will also produce tin beads when it encounters the wave.

Correct selection of flux

There are many reasons for solder balls, but flux is the main reason. General low solid content, no-clean flux is more likely to form solder balls, especially when the bottom surface of the SMD components need to double PCBA wave soldering, this is because these additives are not designed to be used for a long time. If the flux sprayed on the PCB after the first wave has been used up, there is no flux after the second wave, so it can not function as a flux and help reduce solder balls. One of the main ways to reduce the number of solder balls is to choose the right flux. Choose a flux that can withstand heat for a longer period of time.

Shenzhen RayMing is an electronic product processing company specializing in SMT chip processing, DIP plug-in processing, PCBA package, PCB circuit board manufacturing, with 16 years of experience in electronic processing, as well as advanced production equipment and perfect after-sales service system. Welcome new and old customers to call us!

Car reversing radar

Shenzhen RayMing technology according to the information provided by customers, has successfully achieved a full set of research and development and has been delivered to customers complete finished products and other typical product cases, only for customers and engineers reference to learn!

The reversing radar is composed of ultrasonic sensing (probe), controller and display (or buzzer) and other parts. Backing radar adopts ultrasonic distance principle, under the control of the controller, the sensor emits ultrasonic signal, when encountering obstacles, generate echo signal, the sensor receives the echo signal by the controller for data processing and judgment of the location of obstacles, the display shows the distance and other warning signals, get timely warning, the motorist can do when backing up ” Number”, so that reversing becomes easier and safer.
In the past, reversing radar products are only suitable for installation in cars, and become the standard configuration of high-end cars. Now the new reversing radar has a great improvement in the probe, whether it is a station wagon, MPV, jeep or off-road vehicles with bumpers, etc. There is a corresponding sensor to match, so that the reversing radar is gradually popularized in other car types.
In addition, the new reversing radar not only provides sound alert, but also can look at the scene behind the car through the optional display, reflecting the distance and judging the direction, and the sound alarm has an adjustable switch, which can be turned up, down or off according to personal preference.
RayMing technology long-term electronic market to provide electronic products circuit board development, software programming to finished products processing of a full set of services. Welcome domestic and foreign customers to contact us!

How much does a PCB copy cost?

The price of PCB copy board varies according to different boards and requirements. How to calculate the cost of copy board can refer to the following aspects.

PCB copy board price calculation.

the size of the board
PCB board area size, if the irregular shape of the board, it means the maximum range of the shape. The size of the board are tolerance range, the general shape tolerance of the size of the single side of + / – 0.2 or so.

Board layers
1-38 layers and other different layers of PCB board copy. Here refers to 1 layer is a single panel, 2 layers is a double panel 4 layers is a four-layer board, 6 layers is a 6-layer board! Generally speaking, the same area of the PCB board, the more layers, the higher the cost of copying the board fee.

device density
Device (resistors, capacitors, inductors, etc.) density is directly related to the workload and the difficulty of copying the board (device density of the board in the disassembly of components, record the bit number, grinding board must pay more attention to), so PCB copy cost is also linked to the board device density, the greater the density, the higher the price of copying the board.

ease of operation
The ease of operation of PCB copy board is mainly related to the above two points of the number of layers of the board and the density of the device, but also other aspects, such as the integrity of the board.
Generally speaking, many companies provide PCB copy board, but also provide material procurement and PCBA finished product processing services, and for customers, PCB copy board also need more follow-up development, batch processing and other follow-up work, if you can choose the same copy board company for the entire process of development, will also enjoy certain benefits, reduce the price of copy board, or even free copy board.
Through the above four different reference aspects of the introduction, you can know the price of the copy board to be confirmed according to the different PCB board. The above is a narrow reference of PCB copy board offer. Sometimes it is necessary not only to clone circuit boards, but also to make BOM lists, decrypt chips, make prototypes and even mass production. So the quotation is not a generalization.

How to Route PCBs Elegantly?

As an electronic engineer, the miniaturization of electronic products and the complexity of system design makes PCB design more and more complex.
more and more complex. Today’s highly integrated boards are getting smaller and smaller, and the pins of packaged devices are getting denser and denser, all of which

These have put tremendous pressure on the wiring.

Cabling as the PCB
design process, which will directly affect the performance of the PCB board, the design process is also the most tedious and more demanding.

High. Although many advanced EDA tools now provide automatic wiring functions, and also quite intelligent, but automatic wiring does not guarantee 100% wiring.

wiring does not guarantee 100% of the cloth through rate. Therefore, many engineers are not satisfied with the results of automatic wiring, and manual wiring is still the choice of most engineers.

The manual wiring is still the choice of most engineers, and the electrical rules constrain the wiring to achieve the signal integrity requirements.

requirements. In the PCB design process, wiring can be broadly divided into three realms:
The first is the cloth through, which is also the most basic requirements of PCB design. Line does not work, then the board’s basic role are
No, that is a waste board, not to mention the other.
The second is the performance, which is a measure of a printed circuit board is good or bad standards. Wiring completed, we must consider how to achieve the best

The best performance, to avoid all kinds of interference. The third is beautiful, the line is smooth, excellent performance, but the picture is very beautiful but you

If you do not dare to look, you should consider how to beautify the disorganized lines. The wiring is neat and tidy, but also for the future

The test and maintenance of the great convenience, which is also a senior engineer should have the basic qualities. Wiring is far from

It is not just a simple job, but if you treat wiring as an art, you will

There are different rewards.

Copyboarding gives machines the ability to reason logically

Copyboard gives machines the ability to reason logically. On July 21, 2016, technology solutions provider RayMing Technologies released a study on circuit board copyboard, which shows that 62% of medium and large companies want to use machine learning for business analytics in the next two years. This means that commercial multilayer deep neuron network DNN, is about to become the mainstream business competition strategy pursued by major companies.

　　Although in the long run, the development of real circuit board copyboard is still the global academic community and the business community together need to complete the task, but that still needs a long time to explore and experiment. From the current circuit board copy commercialization needs, it is clear that the use of GPU for circuit board copy commercial has great advantages. That’s why in April 2016, RayMing Technologies launched the world’s first GPU-based deep learning supercomputer copyboard.

　　For the past 60 years, the world’s best scientists have been studying how to emulate the intelligence of electronics by means of board copying. Early proof of “copyboard principle” of the “logical theorist” program allows the machine to have logical reasoning ability, the middle of the expert system allows the machine to obtain human knowledge, and then later aimed at the copyboard technology to learn knowledge on their own machine learning algorithms, scientists have not stopped the exploration of the board copyboard.

　　In the past, copyboard models rely on CPU calculations, but the uniqueness of circuit board copyboard technology lies in distributed parallel computing, which is not based on serial computing CPU is good at. In fact, the GPU for graphics image processing from the beginning is a massively parallel computing, which is why Stanford University’s Professor Enda Wu will consider using the GPU to optimize the original intention of the board copy technology. Research has shown that board copy can provide the equivalent of 2,000 CPUs of deep learning performance.

　　Into 2016, it is also the 60th anniversary of the birth of the circuit board copyboard discipline, based on deep learning machine learning algorithms to become the mainstream of the board copyboard, and the core of deep learning is the multi-layer deep neuron network DNN, which is also the most mature machine copyboard that mainstream scientists can achieve.

Copyboard hardware innovation will affect all aspects of life

PCB copyboard products slowly tend to differentiate, to pcb copyboard for example, in the simultaneous China International Copyboard Hardware Forum, Shenzhen RayMing Technology said, by 2030, China’s industrial pcb copyboard number per 10,000 industrial workers is expected to reach about 300; rural urbanization led to a sharp decline in China’s farmers, unmanned tractors, agricultural drones, backpack copyboard and Harvesting machines will become the new generation of “farming tools.” In the future, nearly half of the minimally invasive surgery pcb copyboard products in large and medium-sized hospitals nationwide will be localized; service pcb copyboard products will enter thousands of households, and the elderly, the disabled and children will each have a service pcb copyboard product of various shapes and sizes.”

　　In this exhibition, pcb copy board and wearable devices, smart home, virtual reality (VR), intelligent medical, pcb copy board within the field of many new products gathered to debut, exhibits cover almost all of the current market cutting-edge smart hardware products. Among them, nothing is hotter than virtual reality products – high performance, low latency, high resolution and continuous optimization of user experience, and provide end-to-end solutions for users.

　　In addition, pcb copy board products also gradually tend to differentiate, including higher performance, high-end algorithms of professional aerial photography; lightweight and convenient, intelligent and easy to use, lower cost of consumer-grade aerial photography and industry-specific pcb copy board products with custom hardware and software, special algorithms and App, etc. Copyboard hardware innovation will affect every aspect of life, providing traditional industries with copyboard customization, copyboard equipment, copyboard manufacturing, copyboard services, and solving the end-to-end supply and demand closed loop and inventory problems. Copyboard hardware is an important entrance and carrier of the Internet of Things and big data, which can also be understood as a complex, huge and virtual intelligent system. With the fusion of various communication technologies such as bus and wireless, the fused pcb copyboard and monitored products can achieve interconnection and interaction with the help of the system platform, bringing a convenient copyboard lifestyle to users.

　　Nowadays, copyboard hardware is being rapidly applied to various fields of economy and society, releasing and giving rise to new demands in various fields such as industry and commerce, agriculture, energy conservation and environmental protection, urban management, etc.